Vulnerabilities (CVE)

Filtered by vendor Qualcomm Subscribe
Filtered by product Sd450 Firmware
Total 125 CVE
CVE Vendors Products Updated CVSS v2 CVSS v3
CVE-2020-11218 1 Qualcomm 548 Apq8017, Apq8017 Firmware, Apq8053 and 545 more 2021-03-18 5.0 MEDIUM 7.5 HIGH
Denial of service in baseband when NW configures LTE betaOffset-RI-Index due to lack of data validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
CVE-2020-11221 1 Qualcomm 802 Apq8009, Apq8009 Firmware, Apq8009w and 799 more 2021-03-18 2.1 LOW 5.5 MEDIUM
Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
CVE-2020-11190 1 Qualcomm 802 Apq8009, Apq8009 Firmware, Apq8009w and 799 more 2021-03-18 6.4 MEDIUM 9.1 CRITICAL
Buffer over-read can happen while parsing received SDP values due to lack of NULL termination check on SDP in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2020-11222 1 Qualcomm 548 Apq8017, Apq8017 Firmware, Apq8053 and 545 more 2021-03-18 6.4 MEDIUM 9.1 CRITICAL
Buffer over read while processing MT SMS with maximum length due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile
CVE-2020-11272 1 Qualcomm 696 Apq8009, Apq8009 Firmware, Apq8009w and 693 more 2021-03-08 10.0 HIGH 9.8 CRITICAL
Before enqueuing a frame to the PE queue for further processing, an entry in a hash table can be deleted and using a stale version later can lead to use after free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2020-11269 1 Qualcomm 1074 Apq8009, Apq8009 Firmware, Apq8009w and 1071 more 2021-03-08 8.3 HIGH 8.8 HIGH
Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
CVE-2020-11170 1 Qualcomm 1010 Apq8009, Apq8009 Firmware, Apq8009w and 1007 more 2021-02-26 10.0 HIGH 9.8 CRITICAL
Out of bound memory access while playing music playbacks with crafted vorbis content due to improper checks in header extraction in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
CVE-2020-11177 1 Qualcomm 814 Apq8009, Apq8009 Firmware, Apq8009w and 811 more 2021-02-26 7.2 HIGH 8.8 HIGH
User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2018-11292 1 Qualcomm 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more 2020-08-24 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
CVE-2018-5837 1 Qualcomm 56 Ipq8074, Ipq8074 Firmware, Mdm9206 and 53 more 2019-10-03 5.0 MEDIUM 7.5 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG which produced repeating output much earlier than expected.
CVE-2017-18314 1 Qualcomm 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more 2019-10-03 10.0 HIGH 9.8 CRITICAL
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.
CVE-2018-11290 1 Qualcomm 54 Mdm9206, Mdm9206 Firmware, Mdm9607 and 51 more 2019-10-03 5.0 MEDIUM 7.5 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820A, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG in use.
CVE-2017-18282 1 Qualcomm 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more 2019-10-03 7.2 HIGH 7.8 HIGH
Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
CVE-2017-18280 1 Qualcomm 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more 2019-10-03 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function.
CVE-2018-11291 1 Qualcomm 72 Ipq8074, Ipq8074 Firmware, Mdm9206 and 69 more 2019-10-03 5.0 MEDIUM 7.5 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN.
CVE-2018-11277 1 Qualcomm 40 Msm8909w, Msm8909w Firmware, Msm8996au and 37 more 2019-10-03 4.6 MEDIUM 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
CVE-2018-5871 1 Qualcomm 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more 2019-10-03 3.3 LOW 6.5 MEDIUM
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
CVE-2018-11267 1 Qualcomm 78 Mdm9206, Mdm9206 Firmware, Mdm9607 and 75 more 2019-03-06 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
CVE-2018-11268 1 Qualcomm 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more 2019-03-05 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
CVE-2018-11982 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2018-11-23 8.3 HIGH 8.8 HIGH
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.